India's first 12-inch wafer fab starts up, Tata Group has paid first Fab IP fee to MPEG: - www.deekpay.com

　　The text is a news article that focuses on the following:

　　1. Taiwan's wafer foundry Power Semiconductor Corp. and India's Tata Group have officially launched plans to build their first 12-inch fab in India. The first instalment of Fab IP payment has been received by the Tata Group.

　　2. The two parties signed a definitive cooperation agreement in New Delhi on 27 September this year, under which MPMC will provide technology licences to assist Tata Electronics in building a wafer fab in Dorela, Gujarat, India, and in transferring mature process technology as well as training Indian employees.

　　3. With an estimated total investment of $11 billion and a monthly production capacity of 50,000 chips, the fab is expected to create more than 20,000 high-tech jobs. The fab mainly produces chips for end-use markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

　　4. While LISI will provide process technology, fab construction and line operation experience, the Tata Group and the Government of India will be primarily responsible for the investment. Power Semiconductor Manufacturing Corporation (PSC) in the fab operation on track, will gradually fade out of the co-operation to set up the fab, the subsequent may be only in the form of shareholding mode of existence.

　　5. Li-SMC has begun sending its engineering team to India to conduct the design of the fab and the site survey of the current location of the fab, and plans to complete the construction and put it into mass production in 2026.

　　6. MPEG also disclosed that the company's customised high-capacitance intermediary layer has been validated by customers and will start mass production and shipment by the end of this year. Additionally, the company's Wafer on Wafer wafer stacking technology has also begun mass production of four-layer DRAM wafer stacking products.

　　7. The report concludes by mentioning that the first instalment of the signing bonus received by the company is an important milestone in the implementation of the Fab IP business, and that it is expected that the future project of the 12-inch wafer fab in India will bring a total profit of more than NT$20 billion.

　　Edited by CoreSmart - Linzi.